THINC33-TO247-28.5-17.5-5.8-0.3 - THERM PAD 28.5MMX17.5MMX5.8MM
Fabrikatzailea Taldea zenbakia
Barne Taldea zenbakia
fabrikatzailea
Azalpen laburra
THERM PAD 28.5MMX17.5MMX5.8MM
RoHS Status
Doinua libre / RoHS betetzen
Delivery Time
1-2 egun
Kopurua eskura
1140500 Pieces
Erreferentzia Prezioa
Gure prezioa
- (Mesedez jarri gurekin hobeto prezio bat: [email protected])
- AX Semiconductor dute THINC33-TO247-28.5-17.5-5.8-0.3 stock saltzen da.
- Aukera Ontziak eta denbora bidalketa:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Ordainketa Aukerak:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
zehaztapenak THINC33-TO247-28.5-17.5-5.8-0.3
Kalitatea Bermatzeko :
365 egun bermerik
stock Baliabideen :
Frankizia banatzailea / Fabrikatzailea Zuzeneko
Jatorrizko herrialdea :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Taldea zenbakia :
THINC33-TO247-28.5-17.5-5.8-0.3
fabrikatzailea :
t-Global Technology
deskribapena :
THERM PAD 28.5MMX17.5MMX5.8MM
Series :
THINC
Taldearen egoera :
Active
Usage :
TO-247
Mota :
Interface Cap
forma :
Rectangular
eskema :
28.50mm x 17.50mm x 5.80mm
Lodiera :
0.0120" (0.305mm)
Material :
Silicone
Atxikidura :
-
Babeslea, garraiolaria :
-
Kolore :
Gray
Erresistentzia termikoa :
-
Eroankortasun termikoa :
1.9 W/m-K
pisu :
-
baldintza :
Berria eta original
Erlazionatutako estekak :
THINC33-TO , THINC33-TO247-2
Dokumentuak THINC33-TO247-28.5-17.5-5.8-0.3
Fitxak :
THINC33-TO247-28.5-17.5-5.8-0.3.pdf
produktu erlazionatutako THINC33-TO247-28.5-17.5-5.8-0.3 t-Global Technology
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