BDN12-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.21SQ

Fabrikatzailea Taldea zenbakia

BDN12-3CB/A01

Barne Taldea zenbakia

AX-BDN12-3CB/A01

fabrikatzailea

CTS Thermal Management Products

Azalpen laburra

HEATSINK CPU W/ADHESIVE 1.21SQ

RoHS Status

Doinua libre / RoHS betetzen

Delivery Time

1-2 egun

Kopurua eskura

175125 Pieces

Erreferentzia Prezioa

~~USD 1.602~~

Gure prezioa

- (Mesedez jarri gurekin hobeto prezio bat: [email protected])

AX Semiconductor dute BDN12-3CB/A01 stock saltzen da.

Aukera Ontziak eta denbora bidalketa:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Ordainketa Aukerak:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

zehaztapenak BDN12-3CB/A01

Kalitatea Bermatzeko : 365 egun bermerik

stock Baliabideen : Frankizia banatzailea / Fabrikatzailea Zuzeneko

Jatorrizko herrialdea : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Taldea zenbakia : BDN12-3CB/A01

fabrikatzailea : CTS Thermal Management Products

deskribapena : HEATSINK CPU W/ADHESIVE 1.21SQ

Series : BDN

Taldearen egoera : Active

Mota : Top Mount

Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)

Eranskineko metodoa : Thermal Tape, Adhesive (Included)

forma : Square, Pin Fins

Luzera : 1.210" (30.73mm)

Zabalera : 1.210" (30.73mm)

diametroa : -

Altuera Itxi Oinarria (Altueraren altuera) : 0.355" (9.02mm)

Potentzia xahutzea @ tenperatura igoera : -

Erresistentzia termikoa @ Aire Fluxu behartua : 6.80°C/W @ 400 LFM

Erresistentzia termikoa @ Naturala : 19.60°C/W

Material : Aluminum

Materialaren akabera : Black Anodized

pisu : -

baldintza : Berria eta original

Erlazionatutako estekak : BDN1 , BDN12-

Dokumentuak BDN12-3CB/A01

Fitxak : BDN12-3CB/A01.pdf

produktu erlazionatutako BDN12-3CB/A01 CTS Thermal Management Products

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