BDN11-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.11SQ

Fabrikatzailea Taldea zenbakia
Barne Taldea zenbakia
Azalpen laburra
HEATSINK CPU W/ADHESIVE 1.11SQ
RoHS Status
Doinua libre / RoHS betetzen
Delivery Time
1-2 egun
Kopurua eskura
170655 Pieces
Erreferentzia Prezioa
USD 1.644
Gure prezioa
- (Mesedez jarri gurekin hobeto prezio bat: [email protected])

AX Semiconductor dute BDN11-3CB/A01 stock saltzen da.
Aukera Ontziak eta denbora bidalketa:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Ordainketa Aukerak:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

zehaztapenak BDN11-3CB/A01

Kalitatea Bermatzeko : 365 egun bermerik
stock Baliabideen : Frankizia banatzailea / Fabrikatzailea Zuzeneko
Jatorrizko herrialdea : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Taldea zenbakia : BDN11-3CB/A01
fabrikatzailea : CTS Thermal Management Products
deskribapena : HEATSINK CPU W/ADHESIVE 1.11SQ
Series : BDN
Taldearen egoera : Active
Mota : Top Mount
Paketea hoztu da : Assorted (BGA, LGA, CPU, ASIC...)
Eranskineko metodoa : Thermal Tape, Adhesive (Included)
forma : Square, Pin Fins
Luzera : 1.110" (28.19mm)
Zabalera : 1.110" (28.19mm)
diametroa : -
Altuera Itxi Oinarria (Altueraren altuera) : 0.355" (9.02mm)
Potentzia xahutzea @ tenperatura igoera : -
Erresistentzia termikoa @ Aire Fluxu behartua : 7.20°C/W @ 400 LFM
Erresistentzia termikoa @ Naturala : 20.90°C/W
Material : Aluminum
Materialaren akabera : Black Anodized
pisu : -
baldintza : Berria eta original
Erlazionatutako estekak : BDN1 , BDN11-

Dokumentuak BDN11-3CB/A01

produktu erlazionatutako BDN11-3CB/A01 CTS Thermal Management Products

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